Building Agentic AI Systems
Build connected agent systems with MCP, A2A, agent loops, harness engineering, and cloud deployment
$85.68
- Paperback
440 pages
- Release Date
28 October 2026
Summary
Go beyond standalone agents. Build interoperable, production-ready agent systems with MCP, A2A, agent loops, harness engineering, evaluation, observability, safety, and enterprise cloud deployment.
Key Features
- New in the second edition: Connect agents with MCP, A2A, and modern multi-agent frameworks.
- Engineer reliable agent loops and harnesses for memory, tools, context, retries, and guardrails.
- Evaluate, secure, obser…
Book Details
| ISBN-13: | 9781807302535 |
|---|---|
| ISBN-10: | 1807302539 |
| Author: | Anjanava Biswas, Wrick Talukdar, Michael Condry |
| Publisher: | Packt Publishing Limited |
| Imprint: | Packt Publishing Limited |
| Format: | Paperback |
| Number of Pages: | 440 |
| Edition: | 2nd |
| Release Date: | 28 October 2026 |
| Dimensions: | 191mm x 235mm |
Anjanava Biswas
Anjanava Biswas
Anjanava Biswas is an award-winning senior Applied AI engineer and architect at Google, with over 18 years of industry experience. Specializing in machine learning, Generative AI, natural language processing, deep learning, data analytics, and cloud architecture, he partners with large enterprises to build and scale advanced AI systems in the cloud. Anjanava is widely recognized for his contributions to the field of applied AI. He has published research in multiple scientific journals and actively contributes to open-source AI/ML projects. His professional accolades include Fellowships with BCS (UK), the IET (UK), and IETE (India), and he is a senior IEEE member. A frequent public speaker, Anjanava has held key positions at industry giants like AWS, IBM and Oracle Corp. Originally from India, he now resides in San Diego, CA, with his wife and son, where he continues to innovate and inspire within the tech community.
Wrick Talukdar
Wrick Talukdar is a technology leader in generative AI at Amazon, with over two decades of global experience across AI, cloud computing, and product leadership. He has led large-scale modernization initiatives that drive enterprise growth and reach millions of users worldwide and has spearheaded the productization of award-winning AI/ML technologies now deployed at scale across Fortune 500 companies. His research spans generative AI, multimodality, speech, and computer vision, and is widely cited and referenced in the field. Wrick serves as Chair of Technology and Innovation for the Industry Engagement Committee and as a Senior Technical Committee Member of the IEEE Machine Learning, Deep Learning and AI in Consumer Electronics and the Industry AI Labs(IEC). Across these roles he helps shape technical standards, drives research and innovation in next-generation products and solutions, and influences the future direction of safe AI and its adoption, while mentoring young professionals entering the field.
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